thermal: ti-soc-thermal: use standard GPIO DT bindings
authorEduardo Valentin <eduardo.valentin@ti.com>
Fri, 7 Jun 2013 15:11:53 +0000 (11:11 -0400)
committerEduardo Valentin <eduardo.valentin@ti.com>
Mon, 8 Jul 2013 14:11:59 +0000 (10:11 -0400)
commit57d1617137dd61825a3a7cebf61015f58afce510
tree435ee366eca2964c02d51a755d75a588ef1a84a2
parent65d467e84600754712fb36accd74b036cd775e5e
thermal: ti-soc-thermal: use standard GPIO DT bindings

This change updates the ti-soc-thermal driver to use
standard GPIO DT bindings to read the GPIO number associated
to thermal shutdown IRQ, in case the device features it.

Previously, the code was using a specific DT bindings.
As now OMAP supports the standard way to model GPIOs,
there is no point in having a ti specific binding.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devicetree-discuss@lists.ozlabs.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt
drivers/thermal/ti-soc-thermal/ti-bandgap.c