hwmon: (max6650) add thermal cooling device capability
authorJean-Francois Dagenais <jeff.dagenais@gmail.com>
Fri, 19 Apr 2019 00:57:22 +0000 (20:57 -0400)
committerGuenter Roeck <linux@roeck-us.net>
Sat, 20 Apr 2019 14:08:15 +0000 (07:08 -0700)
commit4f8d374b770a2e26088186d6c18acf582227129d
tree4be6838793c8bf4b86e964828321731a3446475d
parent023912dbb80f5faf7a028aad6562774472d82a5a
hwmon: (max6650) add thermal cooling device capability

This allows max6650 devices to be referenced in dts as a cooling device.

The pwm value seems duplicated in cooling_dev_state but since pwm goes
through rounding logic into data->dac, it is modified and messes with
the thermal zone state algorithms. It's also better to serve a cache
value, thus avoiding periodic actual i2c traffic.

Signed-off-by: Jean-Francois Dagenais <jeff.dagenais@gmail.com>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
drivers/hwmon/Kconfig
drivers/hwmon/max6650.c