1 # SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
4 $id: http://devicetree.org/schemas/vendor-prefixes.yaml#
5 $schema: http://devicetree.org/meta-schemas/core.yaml#
7 title: Devicetree Vendor Prefix Registry
10 - Rob Herring <robh@kernel.org>
17 # Prefixes which are not vendors, but followed the pattern
18 # DO NOT ADD NEW PROPERTIES TO THIS LIST
19 "^(at25|bm|devbus|dmacap|dsa|exynos|fsi[ab]|gpio-fan|gpio-key|gpio|gpmc|hdmi|i2c-gpio),.*": true
20 "^(keypad|m25p|max8952|max8997|max8998|mpmc),.*": true
21 "^(pinctrl-single|#pinctrl-single|PowerPC),.*": true
22 "^(pl022|pxa-mmc|rcar_sound|rotary-encoder|s5m8767|sdhci),.*": true
23 "^(simple-audio-card|st-plgpio|st-spics|ts),.*": true
25 # Keep list in alphabetical order.
27 description: Baiwen.com (100ask).
29 description: 70mai Co., Ltd.
31 description: 8devices, UAB
35 description: Abilis Systems
37 description: Abracon Corporation
39 description: ShenZhen Asia Better Technology Ltd.
41 description: Acer Inc.
43 description: Acme Systems srl
45 description: Actions Semiconductor Co., Ltd.
47 description: Active-Semi International Inc
49 description: Avionic Design GmbH
51 description: Adafruit Industries, LLC
53 description: Adapteva, Inc.
55 description: Adaptrum, Inc.
57 description: AD Holdings Plc.
59 description: Analog Devices, Inc.
61 description: Advantech Corporation
62 "^aeroflexgaisler,.*":
63 description: Aeroflex Gaisler AB
65 description: AESOP Embedded Forum
69 description: Annapurna Labs
73 description: ALFA Network Inc.
75 description: Allegro DVT
79 description: Allwinner Technology Co., Ltd.
81 description: AlphaScale Integrated Circuits Systems, Inc.
83 description: Alps Electric Co., Ltd.
85 description: Altus-Escon-Company BV
87 description: Altera Corp.
89 description: Amarula Solutions
91 description: Amazon.com, Inc.
93 description: Applied Micro Circuits Corporation (APM, formally AMCC)
95 description: Advanced Micro Devices (AMD), Inc.
97 description: Shenzhen Amediatech Technology Co., Ltd
99 description: Amlogic, Inc.
101 description: Ampere Computing LLC
103 description: Ampire Co., Ltd.
107 description: AMS-Taos Inc.
109 description: Analogix Semiconductor, Inc.
111 description: Anbernic
113 description: Andes Technology Corporation
115 description: Anvo-Systems Dresden GmbH
117 description: Applied Micro Circuits Corporation (APM)
119 description: Apple Inc.
121 description: Aptina Imaging
123 description: Arasan Chip Systems
125 description: ArcherMind Technology (Nanjing) Co., Ltd.
127 description: Arctic Sand
129 description: arcx Inc. / Archronix Inc.
131 description: Aries Embedded GmbH
133 description: ARM Ltd.
135 description: ARMadeus Systems SARL
137 description: Arrow Electronics
139 description: Artesyn Embedded Technologies Inc.
141 description: Asahi Kasei Corp.
143 description: All Sensors Corporation
145 description: ASIX Electronics Corporation
147 description: ASPEED Technology Inc.
149 description: ASRock Inc.
151 description: AsusTek Computer Inc.
153 description: Qualcomm Atheros, Inc. (deprecated, use qca)
156 description: Atlas Scientific LLC
158 description: Atmel Corporation
160 description: AU Optronics Corporation
162 description: Auvidea GmbH
164 description: Avago Technologies
166 description: avia semiconductor
168 description: Shanghai AVIC Optoelectronics Co., Ltd.
170 description: Avnet, Inc.
172 description: Shanghai Awinic Technology Co., Ltd.
174 description: Axentia Technologies AB
176 description: Axis Communications AB
178 description: Azoteq (Pty) Ltd
180 description: Shenzhen AZW Technology Co., Ltd.
182 description: BAIKAL ELECTRONICS, JSC
184 description: BIPAI KEJI LIMITED
186 description: Compass Electronics Group, LLC
188 description: BeagleBoard.org Foundation
190 description: Beckhoff Automation GmbH & Co. KG
192 description: Bitmain Technologies
194 description: BluTek Power
196 description: BOE Technology Group Co., Ltd.
198 description: Bosch Sensortec GmbH
200 description: Boundary Devices Inc.
202 description: Shanghai Broadmobi Communication Technology Co.,Ltd.
204 description: Broadcom Corporation
206 description: BSH Hausgeraete GmbH
208 description: Bticino International
210 description: Buffalo, Inc.
212 description: B&R Industrial Automation GmbH
214 description: ByteDance Ltd.
216 description: CalAmp Corp.
218 description: CALAO Systems SAS
222 description: Canaan, Inc.
224 description: Caninos Loucos Program
226 description: Capella Microsystems, Inc
228 description: Cascoda, Ltd.
230 description: Catalyst Semiconductor, Inc.
232 description: Cavium, Inc.
234 description: Cadence Design Systems Inc.
236 description: CDTech(H.K.) Electronics Limited
238 description: CellWise Microelectronics Co., Ltd
240 description: Ceva, Inc.
242 description: Check Point Software Technologies Ltd.
244 description: Chefree Technology Corp.
246 description: Chipidea, Inc
250 description: ChipSPARK
252 description: Shenzhen Chongzhou Electronic Technology Co., Ltd
254 description: Chrontel, Inc.
256 description: Common Hardware Reference Platform
258 description: Chunghwa Picture Tubes Ltd.
260 description: Chuwi Innovation Ltd.
262 description: Computadora Industrial Abierta Argentina
264 description: Cirrus Logic, Inc.
266 description: Cisco Systems, Inc.
268 description: Carl Cloos Schweisstechnik GmbH.
270 description: Cloud Engines, Inc.
272 description: Chips&Media, Inc.
274 description: Conexant Systems, Inc.
276 description: Colorful GRP, Shenzhen Xueyushi Technology Ltd.
278 description: CompuLab Ltd.
280 description: congatec GmbH
282 description: CORERIVER Semiconductor Co.,Ltd.
284 description: Chengdu Corpro Technology Co., Ltd.
286 description: Cortina Systems, Inc.
288 description: Cosmic Circuits
290 description: Crane Connectivity Solutions
292 description: Creative Technology Ltd
294 description: Crystalfontz America, Inc.
296 description: Hangzhou C-SKY Microsystems Co., Ltd
298 description: Shenzen Chuangsiqi Technology Co.,Ltd.
300 description: CTERA Networks Intl.
302 description: Czech Technical University in Prague
304 description: Cubietech, Ltd.
306 description: CUI Devices
308 description: Cypress Semiconductor Corporation
310 description: Shenzhen CYX Industrial Co., Ltd
312 description: CZ.NIC, z.s.p.o.
314 description: Maxim Integrated Products (formerly Dallas Semiconductor)
316 description: DataImage, Inc.
318 description: DAVICOM Semiconductor, Inc.
320 description: Dell Inc.
322 description: Delta Electronics, Inc.
324 description: Densitron Technologies Ltd
326 description: Denx Software Engineering
328 description: Devantech, Ltd.
330 description: DFI Inc.
332 description: DH electronics GmbH
334 description: Shenzhen Yagu Electronic Technology Co., Ltd.
336 description: Digi International Inc.
338 description: Diglent, Inc.
340 description: Diodes, Inc.
342 description: Dioo Microcircuit Co., Ltd
344 description: DLC Display Co., Ltd.
346 description: Dialog Semiconductor
348 description: D-Link Corporation
350 description: Data Modul AG
352 description: Domintech Co., Ltd.
354 description: Dongwoon Anatech
356 description: DPTechnics
358 description: Dragino Technology Co., Limited
360 description: DaSheng, Inc.
362 description: dServe Technology B.V.
364 description: Dyna-Image
366 description: Embedded Artists AB
368 description: Zhejiang Ebang Communication Co., Ltd
372 description: EBS-SYSTART GmbH
374 description: EBV Elektronik
376 description: Eckelmann AG
378 description: EDIMAX Technology Co., Ltd
380 description: Emerging Display Technologies
382 description: eGalax_eMPIA Technology Inc
384 description: Einfochips
386 description: E Ink Corporation
388 description: Elan Microelectronic Corp.
390 description: Element14 (A Premier Farnell Company)
392 description: Elgin S/A.
394 description: Shenzhen Elida Technology Co., Ltd.
396 description: Elimo Engineering Ltd.
398 description: Elpida Memory, Inc.
400 description: Shenzhen Embest Technology Co., Ltd.
402 description: Emlid, Ltd.
404 description: EM Microelectronic
405 "^empire-electronix,.*":
406 description: Empire Electronix
408 description: emtrion GmbH
410 description: Enclustra GmbH
412 description: Endless Mobile, Inc.
414 description: ENE Technology, Inc.
416 description: Silicon Laboratories (formerly Energy Micro AS)
418 description: Engicam S.r.l.
420 description: Engleder
422 description: EPCOS AG
424 description: Ecole Polytechnique Fédérale de Lausanne
426 description: Seiko Epson Corp.
428 description: Espressif Systems Co. Ltd.
430 description: ESTeem Wireless Modems
432 description: NI Ettus Research
434 description: Eukréa Electromatique
436 description: Everest Semiconductor Co. Ltd.
438 description: Everspin Technologies, Inc.
440 description: Evervision Electronics Co. Ltd.
442 description: Exar Corporation
446 description: Exegin Technologies Limited
448 description: EZchip Semiconductor
450 description: Facebook
452 description: Fairphone B.V.
454 description: Faraday Technology Corporation
456 description: Fastrax Oy
458 description: Fairchild Semiconductor
460 description: Shenzhen Feixin Photoelectic Co., Ltd
462 description: Shenzhen Fly Young Technology Co.,LTD.
464 description: Foxconn Industrial Internet
468 description: FocalTech Systems Co.,Ltd
470 description: Baoding Forlinx Embedded Technology Co., Ltd.
472 description: Shenzhen Frida LCD Co., Ltd.
474 description: Guangzhou FriendlyARM Computer Tech Co., Ltd
476 description: Freescale Semiconductor
478 description: Fujitsu Ltd.
480 description: FX Technology Ltd.
482 description: GARDENA GmbH
484 description: Gateworks Corporation
486 description: Game Consoles Worldwide
488 description: General Electric Company
490 description: GeekBuying
492 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
494 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
496 description: Gemei Digital Technology Co., Ltd.
498 description: Geniatech, Inc.
500 description: Giantec Semiconductor, Inc.
502 description: Giantplus Technology Co., Ltd.
504 description: Globalscale Technologies, Inc.
506 description: GlobalTop Technology, Inc.
508 description: Global Mixed-mode Technology, Inc.
510 description: Shenzhen Huiding Technology Co., Ltd.
512 description: Google, Inc.
516 description: Garmin Limited
518 description: Gumstix, Inc.
520 description: Gateworks Corporation
521 use "gateworks" vendor prefix
524 description: HannStar Display Corporation
526 description: Shenzhen Haochuangyi Technology Co.,Ltd
528 description: Haoyu Microelectronic Co. Ltd.
530 description: Hardkernel Co., Ltd
532 description: Shenzhen Hechuang Intelligent Co.
534 description: HiDeep Inc.
536 description: Himax Technologies, Inc.
538 description: Hirschmann Automation and Control GmbH
540 description: HiSilicon Limited (deprecated, use hisilicon)
543 description: HiSilicon Limited.
545 description: Hitachi Ltd.
547 description: Hitex Development Tools
549 description: Holt Integrated Circuits, Inc.
551 description: Honestar Technologies Co., Ltd.
553 description: Honeywell
555 description: Jiangsu HopeRun Software Co., Ltd.
557 description: Hewlett Packard Inc.
559 description: Hewlett Packard Enterprise
561 description: HannStar Display Co.
563 description: Holtek Semiconductor, Inc.
565 description: Huawei Technologies Co., Ltd.
567 description: Shenzhen Hugsun Technology Co. Ltd.
569 description: HwaCom Systems Inc.
571 description: HXT Semiconductor
573 description: Hycon Technology Corp.
575 description: Hydis Technologies
577 description: Shanghai Hynitron Microelectronics Co. Ltd.
579 description: SK Hynix Inc.
581 description: Hyundai Technology
583 description: I2SE GmbH
585 description: International Business Machines (IBM)
587 description: IC Plus Corp.
589 description: Integrated Device Technologies, Inc.
591 description: Ingenieurburo Fur Ic-Technologie (I/F/I)
593 description: ILI Technology Corporation (ILITEK)
595 description: Imagis Technologies Co., Ltd.
597 description: Imagination Technologies Ltd.
599 description: Integrated Micro-Electronics Inc.
601 description: In-Circuit GmbH
603 description: Shenzhen iNet Mobile Internet Technology Co., Ltd
605 description: Infineon Technologies
607 description: Inforce Computing
609 description: Ingrasys Technology Inc.
611 description: InfoVision Optoelectronics Kunshan Co. Ltd.
613 description: Ingenic Semiconductor
615 description: Injoinic Technology Corp.
617 description: InnoComm Mobile Technology Corp.
619 description: Innolux Corporation
621 description: INSIDE Secure
623 description: Insignal Ltd.
625 description: Inspur Corporation
627 description: Intel Corporation
629 description: Inter Control Group
631 description: InvenSense Inc.
633 description: Inventec
635 description: Inverse Path
637 description: Iomega Corporation
639 description: ISEE 2007 S.L.
641 description: Intersil
643 description: Integrated Silicon Solutions Inc.
645 description: ITE Tech. Inc.
647 description: ITEAD Intelligent Systems Co.Ltd
649 description: ITian Corporation
651 description: iWave Systems Technologies Pvt. Ltd.
653 description: Jadard Technology Inc.
655 description: Japan Display Inc.
657 description: JEDEC Solid State Technology Association
659 description: Shenzhen Jesurun Electronics Business Dept.
661 description: JetHome (IP Sokolov P.A.)
663 description: Jiandangjing Technology Co., Ltd.
667 description: Kamstrup A/S
669 description: Ka-Ro electronics GmbH
671 description: Keith & Koep GmbH
673 description: Keymile GmbH
677 description: Kieback & Peter GmbH
679 description: Kinetic Technologies
681 description: King & Display Technology Co., Ltd.
683 description: Kingnovel Technology Co., Ltd.
685 description: Kionix, Inc.
687 description: Rakuten Kobo Inc.
689 description: Kobol Innovations Pte. Ltd.
691 description: Kaohsiung Opto-Electronics Inc.
693 description: Kontron S&T AG
695 description: Sutajio Ko-Usagi PTE Ltd.
697 description: Kverneland Group
699 description: Kyocera Corporation
703 description: Laird PLC
705 description: Ketai Huajie Technology Co., Ltd.
707 description: Lantiq Semiconductor
709 description: Lattice Semiconductor
711 description: Shenzhen Leadtek Technology Co., Ltd.
715 description: LEGO Systems A/S
717 description: Shenzhen LeMaker Technology Co., Ltd.
719 description: Lenovo Group Ltd.
721 description: LG Corporation
723 description: LG Display
725 description: Shenzhen Libre Technology Co., Ltd
727 description: Lichee Pi
729 description: Linaro Limited
731 description: LinkSprite Technologies, Inc.
733 description: Belkin International, Inc. (Linksys)
735 description: Linutronix GmbH
737 description: Linux-specific binding
739 description: Linx Technologies
741 description: LITE-ON Technology Corp.
743 description: LiteX SoC builder
745 description: Linear Technology Corporation
747 description: Logic PD, Inc.
749 description: Logic Technologies Limited
751 description: Longcheer Technology (Shanghai) Co., Ltd.
753 description: Lontium Semiconductor Corporation
755 description: Loongson Technology Corporation Limited
757 description: LSI Corp. (LSI Logic)
759 description: Liebherr-Werk Nenzing GmbH
761 description: Linux Automation GmbH
765 description: Macnica Americas
767 description: Mantix Display Technology Co.,Ltd.
769 description: Mapleboard.org
771 description: Marvell Technology Group Ltd.
773 description: MaxBotix Inc.
775 description: Maxim Integrated Products
777 description: Mobiveil Inc.
781 description: Measurement Specialties
783 description: Mustek Limited
785 description: MediaTek Inc.
787 description: MegaChips
789 description: Shenzhen MeLE Digital Technology Ltd.
791 description: Melexis N.V.
793 description: MELFAS Inc.
795 description: Mellanox Technologies
797 description: MEMSensing Microsystems Co., Ltd.
799 description: MEMSIC Inc.
801 description: Menlo Systems GmbH
803 description: Mentor Graphics
805 description: Cisco Meraki, LLC
807 description: Merrii Technology Co., Ltd.
809 description: Methode Electronics, Inc.
811 description: Micrel Inc.
813 description: Microchip Technology Inc.
815 description: Micro Crystal AG
817 description: Micron Technology Inc.
819 description: Microsoft Corporation
821 description: MicroSys Electronics GmbH
823 description: MikroElektronika d.o.o.
825 description: MikroTik
827 description: Miniand Tech
829 description: MINIX Technology Ltd.
831 description: MiraMEMS Sensing Technology Co., Ltd.
833 description: Mitsubishi Electric Corporation
835 description: Mixel, Inc.
839 description: MNT Research GmbH
841 description: Modtronix Engineering
843 description: Moortec Semiconductor Ltd.
845 description: Mosaix Technologies, Inc.
847 description: Motorola, Inc.
849 description: Moxa Inc.
853 description: Monolithic Power Systems Inc.
855 description: mqmaker Inc.
857 description: Marvell Technology Group Ltd.
860 description: Microsemi Corporation
862 description: Micro-Star International Co. Ltd.
864 description: MStar Semiconductor, Inc. (acquired by MediaTek Inc.)
866 description: Imagination Technologies Ltd. (formerly MIPS Technologies Inc.)
868 description: Multi-Inno Technology Co.,Ltd
870 description: Mundo Reader S.L.
872 description: Murata Manufacturing Co., Ltd.
874 description: Macronix International Co., Ltd.
877 description: Macronix International Co., Ltd.
879 description: MYIR Tech Limited
881 description: National Semiconductor
883 description: NEC LCD Technologies, Ltd.
885 description: Neonode Inc.
889 description: Broadcom Corporation (formerly NetLogic Microsystems)
891 description: Netron DY
893 description: Netronix, Inc.
895 description: Shenzhen Netxeon Technology CO., LTD
897 description: Guangdong Neweast Optoelectronics CO., LTD
899 description: New Vision Display (Shenzhen) Co., Ltd.
903 description: Next Thing Co.
905 description: Newhaven Display International
907 description: National Instruments
909 description: Nintendo
911 description: NLT Technologies, Ltd.
915 description: Nordic Semiconductor
917 description: NovTech, Inc.
919 description: NutsBoard
921 description: Nuvoton Technology Corporation
923 description: New Vision Display
927 description: NXP Semiconductors
929 description: Oceanic Systems (UK) Ltd.
931 description: Orient Chip Technology Co., Ltd.
933 description: Octavo Systems LLC
935 description: Okaya Electric America, Inc.
937 description: Oki Electric Industry Co., Ltd.
939 description: OLIMEX Ltd.
941 description: One Laptop Per Child
943 description: OnePlus Technology (Shenzhen) Co., Ltd.
945 description: Onion Corporation
947 description: ON Semiconductor Corp.
949 description: On Tat Industrial Company
951 description: Opal Kelly Incorporated
953 description: openailab.com
955 description: OpenCores.org
957 description: OpenEmbed
959 description: OpenRISC.io
961 description: Option NV
963 description: Shenzhen Oranth Technology Co., Ltd.
965 description: Oracle Corporation
967 description: Orise Technology
969 description: Ortus Technology Co., Ltd.
971 description: OSD Displays
973 description: Sam Nazarko Trading Ltd. (Open Source Media Centre)
975 description: Ouya Inc.
977 description: Overkiz SAS
979 description: OmniVision Technologies
981 description: Oxford Semiconductor, Ltd.
983 description: OzzMaker
985 description: Panasonic Corporation
987 description: Parade Technologies Inc.
989 description: Parallax Inc.
991 description: Precision Design Associates, Inc.
993 description: Pericom Technology Inc.
995 description: Pervasive Displays, Inc.
997 description: PHICOMM Co., Ltd.
999 description: PHYTEC Messtechnik GmbH
1001 description: Picochip Ltd
1005 description: Shenzhen PineRiver Designs Co., Ltd.
1007 description: PIXCIR MICROELECTRONICS Co., Ltd
1009 description: Plantower Co., Ltd
1011 description: Plat\'Home Co., Ltd.
1015 description: Broadcom Corporation (formerly PLX Technology)
1017 description: Plymovent Group BV
1019 description: PNI Sensor Corporation
1021 description: PocketBook International SA
1023 description: Polaroid Corporation
1025 description: Portwell Inc.
1027 description: Poslab Technology Co., Ltd.
1029 description: Point of View International B.V.
1031 description: Powertip Tech. Corp.
1033 description: PowerVR (deprecated, use img)
1035 description: Primux Trading, S.L.
1037 description: PROBOX2 (by W2COMP Co., Ltd.)
1039 description: Protonic Holland
1041 description: PulsedLight, Inc
1043 description: Purism, SPC
1045 description: Qualcomm Atheros, Inc.
1047 description: Qualcomm Technologies, Inc
1049 description: QEMU, a generic and open source machine emulator and virtualizer
1051 description: Qi Hardware
1053 description: Chengdu Kaixuan Information Technology Co., Ltd.
1055 description: QiaoDian XianShi Corporation
1057 description: Shenzhen QiShenglong Industrialist Co., Ltd.
1059 description: QNAP Systems, Inc.
1061 description: Quanta Computer Inc.
1065 description: RaidSonic Technology GmbH
1067 description: Mediatek/Ralink Technology Corp.
1069 description: Ramtron International
1071 description: Raspberry Pi Foundation
1073 description: Raydium Semiconductor Corp.
1075 description: Unisoc Communications, Inc.
1077 description: Realtek Semiconductor Corp.
1079 description: reMarkable AS
1081 description: Renesas Electronics Corporation
1083 description: iMX6 Rex Project
1085 description: Shenzhen Rervision Technology Co., Ltd.
1087 description: Revolution Robotics, Inc. (Revotics)
1089 description: Richtek Technology Corporation
1091 description: Ricoh Co. Ltd.
1093 description: Rikomagic Tech Corp. Ltd
1095 description: RISC-V Foundation
1097 description: Embest RIoT
1099 description: Fuzhou Rockchip Electronics Co., Ltd
1101 description: ROCKTECH DISPLAYS LIMITED
1103 description: ROHM Semiconductor Co., Ltd
1105 description: Ronbo Electronics
1107 description: Shenzhen Roofull Technology Co, Ltd
1109 description: RoseapplePi.org
1111 description: Samsung Semiconductor
1113 description: Samtec/Softing company
1115 description: Sancloud Ltd
1117 description: Sandisk Corporation
1119 description: Satoz International Co., Ltd
1121 description: Smart Battery System
1123 description: Schindler
1125 description: Seagate Technology PLC
1127 description: Seeed Technology Co., Ltd
1129 description: Shenzhen SEI Robotics Co., Ltd
1131 description: Semtech Corporation
1133 description: Senseair AB
1135 description: Sensirion AG
1137 description: Sensortek Technology Corporation
1139 description: Sercomm (Suzhou) Corporation
1141 description: Small Form Factor Committee
1143 description: Solomon Goldentek Display Corporation
1145 description: SG Micro Corp
1147 description: SGX Sensortech
1149 description: Sharp Corporation
1151 description: SHIFT GmbH
1153 description: Shimafuji Electric, Inc.
1155 description: Shiratech Solutions
1157 description: Si-En Technology Ltd.
1159 description: Silicon Linux Corporation
1161 description: SiFive, Inc.
1163 description: Sigma Designs, Inc.
1165 description: Seiko Instruments, Inc.
1167 description: Silicon Image
1169 description: Silicon Laboratories
1171 description: Hangzhou Silan Microelectronics Co., Ltd.
1173 description: Silead Inc.
1175 description: Silergy Corp.
1176 "^silex-insight,.*":
1177 description: Silex Insight
1179 description: Siliconfile Technologies lnc.
1181 description: Silicon Mitus, Inc.
1183 description: Siemens AG
1185 description: Cypress Semiconductor Corporation (Simtek Corporation)
1187 description: Sinlinx Electronics Technology Co., LTD
1189 description: SinoVoip Co., Ltd
1191 description: SINO WEALTH Electronic Ltd.
1193 description: Shenzhen Sipeed Technology Co., Ltd.
1195 description: SiRF Technology, Inc.
1197 description: Silicon Integrated Systems Corp.
1199 description: Sitronix Technology Corporation
1201 description: SKOV A/S
1203 description: Skyworks Solutions, Inc.
1205 description: SmartLabs LLC
1207 description: Standard Microsystems Corporation
1209 description: Synopsys, Inc.
1211 description: Shenzhen SoChip Technology Co., Ltd.
1213 description: Socionext Inc.
1215 description: SolidRun
1217 description: Solomon Systech Limited
1219 description: Sony Corporation
1221 description: Spansion Inc.
1223 description: SparkFun Electronics
1225 description: SpinalHDL
1227 description: Spreadtrum Communications Inc.
1229 description: SSI Computer Corp
1231 description: Silicon Storage Technology, Inc.
1233 description: Xiamen Xingchen(SigmaStar) Technology Co., Ltd.
1234 (formerly part of MStar Semiconductor, Inc.)
1236 description: STMicroelectronics
1238 description: StarFive Technology Co. Ltd.
1240 description: Starry Electronic Technology (ShenZhen) Co., LTD
1242 description: Startek
1244 description: ST-Ericsson
1247 description: ST-Ericsson
1249 description: ST-Ericsson
1252 description: StorLink Semiconductors, Inc.
1254 description: Storm Semiconductor, Inc.
1256 description: Storopack
1258 description: Summit microelectronics
1260 description: Shenzhen Sunchip Technology Co., Ltd
1262 description: Sundance DSP Inc.
1264 description: Sunplus Technology Co., Ltd.
1266 description: Sun Microsystems, Inc
1268 description: Super Micro Computer, Inc.
1270 description: Silvaco, Inc.
1272 description: Sierra Wireless
1274 description: Synaptics Inc.
1276 description: Synology, Inc.
1278 description: Synopsys, Inc. (deprecated, use snps)
1281 description: TBS Technologies
1282 "^tbs-biometrics,.*":
1283 description: Touchless Biometric Systems AG
1285 description: Trusted Computing Group
1287 description: Toby Churchill Ltd.
1289 description: Shenzhen City Tang Cheng Technology Co., Ltd.
1291 description: Shangai Top Display Optoelectronics Co., Ltd
1293 description: TechNexion
1295 description: Technologic Systems
1297 description: Teltonika Networks
1299 description: Tempo Semiconductor
1301 description: Shenzhen Techstar Electronics Co., Ltd.
1303 description: Terasic Inc.
1305 description: Tesla, Inc.
1307 description: Three Five Corp
1309 description: T-Head Semiconductor Co., Ltd.
1311 description: THine Electronics, Inc.
1313 description: thingy.jp
1315 description: Thundercomm Technology Co., Ltd.
1317 description: Texas Instruments
1319 description: Tianma Micro-electronics Co., Ltd.
1321 description: Trusted Logic Mobility
1323 description: Tecon Microprocessor Technologies, LLC.
1327 description: Topic Embedded Systems
1329 description: TPO (deprecated, use tpo)
1332 description: Topwise Communication Co., Ltd.
1334 description: Toradex AG
1336 description: Toshiba Corporation
1340 description: TPK U.S.A. LLC
1342 description: TP-LINK Technologies Co., Ltd.
1346 description: TQ-Systems GmbH
1348 description: Traverse Technologies Australia Pty Ltd
1352 description: Tronsmart
1354 description: Truly Semiconductors Limited
1356 description: Visionox
1357 "^team-source-display,.*":
1358 description: Shenzhen Team Source Display Technology Co., Ltd. (TSD)
1360 description: Theobroma Systems Design und Consulting GmbH
1362 description: Tyan Computer Corporation
1366 description: U-Boot bootloader
1368 description: uCRobotics
1370 description: Ubiquiti Networks
1374 description: Ugoos Industrial Co., Ltd.
1376 description: United Western Technologies Corp (UniWest)
1378 description: uPI Semiconductor Corp.
1380 description: United Radiant Technology Corporation
1382 description: Universal Scientific Industrial Co., Ltd.
1384 description: Aigo Digital Technology Co., Ltd.
1386 description: V3 Semiconductor
1388 description: Vaisala
1390 description: Vamrs Ltd.
1392 description: Variscite Ltd.
1394 description: Van der Laan b.v.
1396 description: Vertexcom Technologies, Inc.
1398 description: VIA Technologies, Inc.
1400 description: Vicor Corporation
1402 description: Videostrong Technology Co., Ltd.
1404 description: Virtual I/O Device Specification, developed by the OASIS consortium
1406 description: Used for virtual device without specific vendor.
1408 description: Vishay Intertechnology, Inc
1410 description: Vitesse Semiconductor Corporation
1412 description: Vivante Corporation
1414 description: Vivax brand by M SAN Grupa d.o.o.
1416 description: VoCore Studio
1418 description: Voipac Technologies s.r.o.
1420 description: Vision Optical Technology Co., Ltd.
1422 description: VXT Ltd
1424 description: Wandbord (Technexion)
1426 description: Waveshare Electronics
1428 description: Western Digital Corp.
1430 description: Würth Elektronik GmbH.
1432 description: Welltech Computer Co., Limited.
1434 description: WeTek Electronics, limited.
1438 description: Shenzhen whwave Electronics, Inc.
1440 description: Wi2Wi, Inc.
1442 description: Wiligear, Ltd.
1444 description: Will Semiconductor Ltd.
1446 description: Winbond Electronics corp.
1448 description: Wingtech Technology Co., Ltd.
1450 description: WinLink Co., Ltd
1452 description: Winstar Display Corp.
1454 description: Wireless Tag (qiming yunduan)
1456 description: Shenzhen Merrii Technology Co., Ltd. (WITS)
1458 description: Wolfson Microelectronics
1460 description: Wondermedia Technologies, Inc.
1464 description: Wanchanglong Electronics Technology(SHENZHEN)Co.,Ltd.
1466 description: X-Powers
1468 description: Xen Hypervisor
1470 description: Extreme Engineering Solutions (X-ES)
1472 description: Xiaomi Technology Co., Ltd.
1474 description: Xillybus Ltd.
1476 description: Shenzhen Xingbangda Display Technology Co., Ltd
1478 description: Shenzhen Xinpeng Technology Co., Ltd
1480 description: Xiphera Ltd.
1486 description: Shenzhen Xunlong Software CO.,Limited
1492 description: Yamaha Corporation
1493 "^yes-optoelectronics,.*":
1494 description: Yes Optoelectronics Co.,Ltd.
1496 description: YIC System Co., Ltd.
1498 description: Shenzhen Yangliming Electronic Technology Co., Ltd.
1500 description: YSH & ATIL
1501 "^yones-toptech,.*":
1502 description: Yones Toptech Co., Ltd.
1504 description: Shenzhen Yashi Changhua Intelligent Technology Co., Ltd.
1506 description: Y Soft Corporation a.s.
1510 description: Zarlink Semiconductor
1512 description: ZEITEC Semiconductor Co., LTD.
1514 description: Shenzhen Zidoo Technology Co., Ltd.
1516 description: Zodiac Inflight Innovations
1518 description: Zinitix Co., Ltd
1520 description: Shenzhen Zkmagic Technology Co., Ltd.
1522 description: ZTE Corp.
1524 description: ZyXEL Communications Corp.
1526 # Normal property name match without a comma
1527 # These should catch all node/property names without a prefix
1528 "^[a-zA-Z0-9#_][a-zA-Z0-9+\\-._@]{0,63}$": true
1529 "^[a-zA-Z0-9+\\-._]*@[0-9a-zA-Z,]*$": true
1532 additionalProperties: false