1 # SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
4 $id: http://devicetree.org/schemas/vendor-prefixes.yaml#
5 $schema: http://devicetree.org/meta-schemas/core.yaml#
7 title: Devicetree Vendor Prefix Registry
10 - Rob Herring <robh@kernel.org>
17 # Prefixes which are not vendors, but followed the pattern
18 # DO NOT ADD NEW PROPERTIES TO THIS LIST
19 "^(at25|bm|devbus|dmacap|dsa|exynos|fsi[ab]|gpio-fan|gpio-key|gpio|gpmc|hdmi|i2c-gpio),.*": true
20 "^(keypad|m25p|max8952|max8997|max8998|mpmc),.*": true
21 "^(pinctrl-single|#pinctrl-single|PowerPC),.*": true
22 "^(pl022|pxa-mmc|rcar_sound|rotary-encoder|s5m8767|sdhci),.*": true
23 "^(simple-audio-card|st-plgpio|st-spics|ts),.*": true
25 # Keep list in alphabetical order.
27 description: Baiwen.com (100ask).
29 description: 70mai Co., Ltd.
31 description: 8devices, UAB
35 description: Abilis Systems
37 description: Abracon Corporation
39 description: ShenZhen Asia Better Technology Ltd.
41 description: Acer Inc.
43 description: Acme Systems srl
45 description: Actions Semiconductor Co., Ltd.
47 description: Active-Semi International Inc
49 description: Avionic Design GmbH
51 description: Adafruit Industries, LLC
53 description: Adapteva, Inc.
55 description: Adaptrum, Inc.
57 description: AD Holdings Plc.
59 description: Analog Devices, Inc.
61 description: Advantech Corporation
62 "^aeroflexgaisler,.*":
63 description: Aeroflex Gaisler AB
65 description: AESOP Embedded Forum
69 description: Annapurna Labs
73 description: Allegro DVT
77 description: Allwinner Technology Co., Ltd.
79 description: AlphaScale Integrated Circuits Systems, Inc.
81 description: Alps Electric Co., Ltd.
83 description: Altus-Escon-Company BV
85 description: Altera Corp.
87 description: Amarula Solutions
89 description: Amazon.com, Inc.
91 description: Applied Micro Circuits Corporation (APM, formally AMCC)
93 description: Advanced Micro Devices (AMD), Inc.
95 description: Shenzhen Amediatech Technology Co., Ltd
97 description: Amlogic, Inc.
99 description: Ampere Computing LLC
101 description: Ampire Co., Ltd.
105 description: AMS-Taos Inc.
107 description: Analogix Semiconductor, Inc.
109 description: Anbernic
111 description: Andes Technology Corporation
113 description: Anvo-Systems Dresden GmbH
115 description: Applied Micro Circuits Corporation (APM)
117 description: Apple Inc.
119 description: Aptina Imaging
121 description: Arasan Chip Systems
123 description: ArcherMind Technology (Nanjing) Co., Ltd.
125 description: Arctic Sand
127 description: arcx Inc. / Archronix Inc.
129 description: Aries Embedded GmbH
131 description: ARM Ltd.
133 description: ARMadeus Systems SARL
135 description: Arrow Electronics
137 description: Artesyn Embedded Technologies Inc.
139 description: Asahi Kasei Corp.
141 description: All Sensors Corporation
143 description: ASIX Electronics Corporation
145 description: ASPEED Technology Inc.
147 description: ASRock Inc.
149 description: AsusTek Computer Inc.
151 description: Qualcomm Atheros, Inc. (deprecated, use qca)
154 description: Atlas Scientific LLC
156 description: Atmel Corporation
158 description: AU Optronics Corporation
160 description: Auvidea GmbH
162 description: Avago Technologies
164 description: avia semiconductor
166 description: Shanghai AVIC Optoelectronics Co., Ltd.
168 description: Avnet, Inc.
170 description: Shanghai Awinic Technology Co., Ltd.
172 description: Axentia Technologies AB
174 description: Axis Communications AB
176 description: Azoteq (Pty) Ltd
178 description: Shenzhen AZW Technology Co., Ltd.
180 description: BAIKAL ELECTRONICS, JSC
182 description: BIPAI KEJI LIMITED
184 description: Compass Electronics Group, LLC
186 description: BeagleBoard.org Foundation
188 description: Beckhoff Automation GmbH & Co. KG
190 description: Bitmain Technologies
192 description: BluTek Power
194 description: BOE Technology Group Co., Ltd.
196 description: Bosch Sensortec GmbH
198 description: Boundary Devices Inc.
200 description: Shanghai Broadmobi Communication Technology Co.,Ltd.
202 description: Broadcom Corporation
204 description: BSH Hausgeraete GmbH
206 description: Bticino International
208 description: Buffalo, Inc.
210 description: B&R Industrial Automation GmbH
212 description: ByteDance Ltd.
214 description: CalAmp Corp.
216 description: CALAO Systems SAS
220 description: Canaan, Inc.
222 description: Caninos Loucos Program
224 description: Capella Microsystems, Inc
226 description: Cascoda, Ltd.
228 description: Catalyst Semiconductor, Inc.
230 description: Cavium, Inc.
232 description: Cadence Design Systems Inc.
234 description: CDTech(H.K.) Electronics Limited
236 description: CellWise Microelectronics Co., Ltd
238 description: Ceva, Inc.
240 description: Check Point Software Technologies Ltd.
242 description: Chefree Technology Corp.
244 description: Chipidea, Inc
248 description: ChipSPARK
250 description: Chrontel, Inc.
252 description: Common Hardware Reference Platform
254 description: Chunghwa Picture Tubes Ltd.
256 description: Chuwi Innovation Ltd.
258 description: Computadora Industrial Abierta Argentina
260 description: Cirrus Logic, Inc.
262 description: Cisco Systems, Inc.
264 description: Cloud Engines, Inc.
266 description: Chips&Media, Inc.
268 description: Conexant Systems, Inc.
270 description: Colorful GRP, Shenzhen Xueyushi Technology Ltd.
272 description: CompuLab Ltd.
274 description: congatec GmbH
276 description: CORERIVER Semiconductor Co.,Ltd.
278 description: Chengdu Corpro Technology Co., Ltd.
280 description: Cortina Systems, Inc.
282 description: Cosmic Circuits
284 description: Crane Connectivity Solutions
286 description: Creative Technology Ltd
288 description: Crystalfontz America, Inc.
290 description: Hangzhou C-SKY Microsystems Co., Ltd
292 description: Shenzen Chuangsiqi Technology Co.,Ltd.
294 description: CTERA Networks Intl.
296 description: Czech Technical University in Prague
298 description: Cubietech, Ltd.
300 description: CUI Devices
302 description: Cypress Semiconductor Corporation
304 description: Shenzhen CYX Industrial Co., Ltd
306 description: CZ.NIC, z.s.p.o.
308 description: Maxim Integrated Products (formerly Dallas Semiconductor)
310 description: DataImage, Inc.
312 description: DAVICOM Semiconductor, Inc.
314 description: Dell Inc.
316 description: Delta Electronics, Inc.
318 description: Densitron Technologies Ltd
320 description: Denx Software Engineering
322 description: Devantech, Ltd.
324 description: DFI Inc.
326 description: DH electronics GmbH
328 description: Shenzhen Yagu Electronic Technology Co., Ltd.
330 description: Digi International Inc.
332 description: Diglent, Inc.
334 description: Dioo Microcircuit Co., Ltd
336 description: DLC Display Co., Ltd.
338 description: Dialog Semiconductor
340 description: D-Link Corporation
342 description: Data Modul AG
344 description: Domintech Co., Ltd.
346 description: Dongwoon Anatech
348 description: DPTechnics
350 description: Dragino Technology Co., Limited
352 description: DaSheng, Inc.
354 description: dServe Technology B.V.
356 description: Dyna-Image
358 description: Embedded Artists AB
360 description: Zhejiang Ebang Communication Co., Ltd
364 description: EBS-SYSTART GmbH
366 description: EBV Elektronik
368 description: Eckelmann AG
370 description: EDIMAX Technology Co., Ltd
372 description: Emerging Display Technologies
374 description: eGalax_eMPIA Technology Inc
376 description: Einfochips
378 description: E Ink Corporation
380 description: Elan Microelectronic Corp.
382 description: Element14 (A Premier Farnell Company)
384 description: Elgin S/A.
386 description: Shenzhen Elida Technology Co., Ltd.
388 description: Elimo Engineering Ltd.
390 description: Elpida Memory, Inc.
392 description: Shenzhen Embest Technology Co., Ltd.
394 description: Emlid, Ltd.
396 description: EM Microelectronic
397 "^empire-electronix,.*":
398 description: Empire Electronix
400 description: emtrion GmbH
402 description: Enclustra GmbH
404 description: Endless Mobile, Inc.
406 description: ENE Technology, Inc.
408 description: Silicon Laboratories (formerly Energy Micro AS)
410 description: Engicam S.r.l.
412 description: Engleder
414 description: EPCOS AG
416 description: Ecole Polytechnique Fédérale de Lausanne
418 description: Seiko Epson Corp.
420 description: Espressif Systems Co. Ltd.
422 description: ESTeem Wireless Modems
424 description: NI Ettus Research
426 description: Eukréa Electromatique
428 description: Everest Semiconductor Co. Ltd.
430 description: Everspin Technologies, Inc.
432 description: Evervision Electronics Co. Ltd.
434 description: Exar Corporation
438 description: Exegin Technologies Limited
440 description: EZchip Semiconductor
442 description: Facebook
444 description: Fairphone B.V.
446 description: Faraday Technology Corporation
448 description: Fastrax Oy
450 description: Fairchild Semiconductor
452 description: Shenzhen Feixin Photoelectic Co., Ltd
454 description: Shenzhen Fly Young Technology Co.,LTD.
456 description: Foxconn Industrial Internet
460 description: FocalTech Systems Co.,Ltd
462 description: Baoding Forlinx Embedded Technology Co., Ltd.
464 description: Shenzhen Frida LCD Co., Ltd.
466 description: Guangzhou FriendlyARM Computer Tech Co., Ltd
468 description: Freescale Semiconductor
470 description: Fujitsu Ltd.
472 description: FX Technology Ltd.
474 description: GARDENA GmbH
476 description: Gateworks Corporation
478 description: Game Consoles Worldwide
480 description: General Electric Company
482 description: GeekBuying
484 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
486 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
488 description: Gemei Digital Technology Co., Ltd.
490 description: Geniatech, Inc.
492 description: Giantec Semiconductor, Inc.
494 description: Giantplus Technology Co., Ltd.
496 description: Globalscale Technologies, Inc.
498 description: GlobalTop Technology, Inc.
500 description: Global Mixed-mode Technology, Inc.
502 description: Shenzhen Huiding Technology Co., Ltd.
504 description: Google, Inc.
508 description: Garmin Limited
510 description: Gumstix, Inc.
512 description: Gateworks Corporation
513 use "gateworks" vendor prefix
516 description: HannStar Display Corporation
518 description: Shenzhen Haochuangyi Technology Co.,Ltd
520 description: Haoyu Microelectronic Co. Ltd.
522 description: Hardkernel Co., Ltd
524 description: Shenzhen Hechuang Intelligent Co.
526 description: HiDeep Inc.
528 description: Himax Technologies, Inc.
530 description: Hirschmann Automation and Control GmbH
532 description: HiSilicon Limited (deprecated, use hisilicon)
535 description: HiSilicon Limited.
537 description: Hitachi Ltd.
539 description: Hitex Development Tools
541 description: Holt Integrated Circuits, Inc.
543 description: Honestar Technologies Co., Ltd.
545 description: Honeywell
547 description: Jiangsu HopeRun Software Co., Ltd.
549 description: Hewlett Packard Inc.
551 description: Hewlett Packard Enterprise
553 description: HannStar Display Co.
555 description: Holtek Semiconductor, Inc.
557 description: Huawei Technologies Co., Ltd.
559 description: Shenzhen Hugsun Technology Co. Ltd.
561 description: HwaCom Systems Inc.
563 description: HXT Semiconductor
565 description: Hycon Technology Corp.
567 description: Hydis Technologies
569 description: SK Hynix Inc.
571 description: Hyundai Technology
573 description: I2SE GmbH
575 description: International Business Machines (IBM)
577 description: IC Plus Corp.
579 description: Integrated Device Technologies, Inc.
581 description: Ingenieurburo Fur Ic-Technologie (I/F/I)
583 description: ILI Technology Corporation (ILITEK)
585 description: Imagis Technologies Co., Ltd.
587 description: Imagination Technologies Ltd.
589 description: Integrated Micro-Electronics Inc.
591 description: In-Circuit GmbH
593 description: Shenzhen iNet Mobile Internet Technology Co., Ltd
595 description: Infineon Technologies
597 description: Inforce Computing
599 description: Ingrasys Technology Inc.
601 description: InfoVision Optoelectronics Kunshan Co. Ltd.
603 description: Ingenic Semiconductor
605 description: Injoinic Technology Corp.
607 description: Innolux Corporation
609 description: INSIDE Secure
611 description: Insignal Ltd.
613 description: Inspur Corporation
615 description: Intel Corporation
617 description: Inter Control Group
619 description: InvenSense Inc.
621 description: Inventec
623 description: Inverse Path
625 description: Iomega Corporation
627 description: ISEE 2007 S.L.
629 description: Intersil
631 description: Integrated Silicon Solutions Inc.
633 description: ITE Tech. Inc.
635 description: ITEAD Intelligent Systems Co.Ltd
637 description: ITian Corporation
639 description: iWave Systems Technologies Pvt. Ltd.
641 description: Japan Display Inc.
643 description: JEDEC Solid State Technology Association
645 description: Shenzhen Jesurun Electronics Business Dept.
647 description: JetHome (IP Sokolov P.A.)
649 description: Jiandangjing Technology Co., Ltd.
653 description: Kamstrup A/S
655 description: Ka-Ro electronics GmbH
657 description: Keith & Koep GmbH
659 description: Keymile GmbH
663 description: Kieback & Peter GmbH
665 description: Kinetic Technologies
667 description: King & Display Technology Co., Ltd.
669 description: Kingnovel Technology Co., Ltd.
671 description: Kionix, Inc.
673 description: Rakuten Kobo Inc.
675 description: Kobol Innovations Pte. Ltd.
677 description: Kaohsiung Opto-Electronics Inc.
679 description: Kontron S&T AG
681 description: Sutajio Ko-Usagi PTE Ltd.
683 description: Kverneland Group
685 description: Kyocera Corporation
689 description: Laird PLC
691 description: Ketai Huajie Technology Co., Ltd.
693 description: Lantiq Semiconductor
695 description: Lattice Semiconductor
697 description: Shenzhen Leadtek Technology Co., Ltd.
701 description: LEGO Systems A/S
703 description: Shenzhen LeMaker Technology Co., Ltd.
705 description: Lenovo Group Ltd.
707 description: LG Corporation
709 description: LG Display
711 description: Shenzhen Libre Technology Co., Ltd
713 description: Lichee Pi
715 description: Linaro Limited
717 description: LinkSprite Technologies, Inc.
719 description: Belkin International, Inc. (Linksys)
721 description: Linutronix GmbH
723 description: Linux-specific binding
725 description: Linx Technologies
727 description: LITE-ON Technology Corp.
729 description: LiteX SoC builder
731 description: Linear Technology Corporation
733 description: Logic PD, Inc.
735 description: Logic Technologies Limited
737 description: Longcheer Technology (Shanghai) Co., Ltd.
739 description: Lontium Semiconductor Corporation
741 description: Loongson Technology Corporation Limited
743 description: LSI Corp. (LSI Logic)
745 description: Liebherr-Werk Nenzing GmbH
747 description: Linux Automation GmbH
751 description: Macnica Americas
753 description: Mantix Display Technology Co.,Ltd.
755 description: Mapleboard.org
757 description: Marvell Technology Group Ltd.
759 description: MaxBotix Inc.
761 description: Maxim Integrated Products
763 description: Mobiveil Inc.
767 description: Measurement Specialties
769 description: Mustek Limited
771 description: MediaTek Inc.
773 description: MegaChips
775 description: Shenzhen MeLE Digital Technology Ltd.
777 description: Melexis N.V.
779 description: MELFAS Inc.
781 description: Mellanox Technologies
783 description: MEMSIC Inc.
785 description: Menlo Systems GmbH
787 description: Mentor Graphics
789 description: Cisco Meraki, LLC
791 description: Merrii Technology Co., Ltd.
793 description: Methode Electronics, Inc.
795 description: Micrel Inc.
797 description: Microchip Technology Inc.
799 description: Micro Crystal AG
801 description: Micron Technology Inc.
803 description: Microsoft Corporation
805 description: MicroSys Electronics GmbH
807 description: MikroElektronika d.o.o.
809 description: MikroTik
811 description: Miniand Tech
813 description: MINIX Technology Ltd.
815 description: MiraMEMS Sensing Technology Co., Ltd.
817 description: Mitsubishi Electric Corporation
819 description: Mixel, Inc.
823 description: MNT Research GmbH
825 description: Modtronix Engineering
827 description: Moortec Semiconductor Ltd.
829 description: Mosaix Technologies, Inc.
831 description: Motorola, Inc.
833 description: Moxa Inc.
837 description: Monolithic Power Systems Inc.
839 description: mqmaker Inc.
841 description: Marvell Technology Group Ltd.
844 description: Microsemi Corporation
846 description: Micro-Star International Co. Ltd.
848 description: MStar Semiconductor, Inc. (acquired by MediaTek Inc.)
850 description: Imagination Technologies Ltd. (formerly MIPS Technologies Inc.)
852 description: Multi-Inno Technology Co.,Ltd
854 description: Mundo Reader S.L.
856 description: Murata Manufacturing Co., Ltd.
858 description: Macronix International Co., Ltd.
861 description: Macronix International Co., Ltd.
863 description: MYIR Tech Limited
865 description: National Semiconductor
867 description: NEC LCD Technologies, Ltd.
869 description: Neonode Inc.
873 description: Broadcom Corporation (formerly NetLogic Microsystems)
875 description: Netron DY
877 description: Netronix, Inc.
879 description: Shenzhen Netxeon Technology CO., LTD
881 description: Guangdong Neweast Optoelectronics CO., LTD
885 description: Next Thing Co.
887 description: Newhaven Display International
889 description: National Instruments
891 description: Nintendo
893 description: NLT Technologies, Ltd.
897 description: Nordic Semiconductor
899 description: NovTech, Inc.
901 description: NutsBoard
903 description: Nuvoton Technology Corporation
905 description: New Vision Display
909 description: NXP Semiconductors
911 description: Oceanic Systems (UK) Ltd.
913 description: Orient Chip Technology Co., Ltd.
915 description: Octavo Systems LLC
917 description: Okaya Electric America, Inc.
919 description: Oki Electric Industry Co., Ltd.
921 description: OLIMEX Ltd.
923 description: One Laptop Per Child
925 description: OnePlus Technology (Shenzhen) Co., Ltd.
927 description: Onion Corporation
929 description: ON Semiconductor Corp.
931 description: On Tat Industrial Company
933 description: Opal Kelly Incorporated
935 description: openailab.com
937 description: OpenCores.org
939 description: OpenEmbed
941 description: OpenRISC.io
943 description: Option NV
945 description: Shenzhen Oranth Technology Co., Ltd.
947 description: Oracle Corporation
949 description: Orise Technology
951 description: Ortus Technology Co., Ltd.
953 description: OSD Displays
955 description: Sam Nazarko Trading Ltd. (Open Source Media Centre)
957 description: Ouya Inc.
959 description: Overkiz SAS
961 description: OmniVision Technologies
963 description: Oxford Semiconductor, Ltd.
965 description: OzzMaker
967 description: Panasonic Corporation
969 description: Parade Technologies Inc.
971 description: Parallax Inc.
973 description: Precision Design Associates, Inc.
975 description: Pericom Technology Inc.
977 description: Pervasive Displays, Inc.
979 description: PHICOMM Co., Ltd.
981 description: PHYTEC Messtechnik GmbH
983 description: Picochip Ltd
987 description: Shenzhen PineRiver Designs Co., Ltd.
989 description: PIXCIR MICROELECTRONICS Co., Ltd
991 description: Plantower Co., Ltd
993 description: Plat\'Home Co., Ltd.
997 description: Broadcom Corporation (formerly PLX Technology)
999 description: Plymovent Group BV
1001 description: PNI Sensor Corporation
1003 description: PocketBook International SA
1005 description: Polaroid Corporation
1007 description: Portwell Inc.
1009 description: Poslab Technology Co., Ltd.
1011 description: Point of View International B.V.
1013 description: Powertip Tech. Corp.
1015 description: PowerVR (deprecated, use img)
1017 description: Primux Trading, S.L.
1019 description: PROBOX2 (by W2COMP Co., Ltd.)
1021 description: Protonic Holland
1023 description: PulsedLight, Inc
1025 description: Purism, SPC
1027 description: Qualcomm Atheros, Inc.
1029 description: Qualcomm Technologies, Inc
1031 description: QEMU, a generic and open source machine emulator and virtualizer
1033 description: Qi Hardware
1035 description: Chengdu Kaixuan Information Technology Co., Ltd.
1037 description: QiaoDian XianShi Corporation
1039 description: Shenzhen QiShenglong Industrialist Co., Ltd.
1041 description: QNAP Systems, Inc.
1043 description: Quanta Computer Inc.
1047 description: RaidSonic Technology GmbH
1049 description: Mediatek/Ralink Technology Corp.
1051 description: Ramtron International
1053 description: Raspberry Pi Foundation
1055 description: Raydium Semiconductor Corp.
1057 description: Unisoc Communications, Inc.
1059 description: Realtek Semiconductor Corp.
1061 description: reMarkable AS
1063 description: Renesas Electronics Corporation
1065 description: iMX6 Rex Project
1067 description: Shenzhen Rervision Technology Co., Ltd.
1069 description: Revolution Robotics, Inc. (Revotics)
1071 description: Richtek Technology Corporation
1073 description: Ricoh Co. Ltd.
1075 description: Rikomagic Tech Corp. Ltd
1077 description: RISC-V Foundation
1079 description: Embest RIoT
1081 description: Fuzhou Rockchip Electronics Co., Ltd
1083 description: ROCKTECH DISPLAYS LIMITED
1085 description: ROHM Semiconductor Co., Ltd
1087 description: Ronbo Electronics
1089 description: Shenzhen Roofull Technology Co, Ltd
1091 description: RoseapplePi.org
1093 description: Samsung Semiconductor
1095 description: Samtec/Softing company
1097 description: Sancloud Ltd
1099 description: Sandisk Corporation
1101 description: Satoz International Co., Ltd
1103 description: Smart Battery System
1105 description: Schindler
1107 description: Seagate Technology PLC
1109 description: Seeed Technology Co., Ltd
1111 description: Shenzhen SEI Robotics Co., Ltd
1113 description: Semtech Corporation
1115 description: Senseair AB
1117 description: Sensirion AG
1119 description: Sensortek Technology Corporation
1121 description: Sercomm (Suzhou) Corporation
1123 description: Small Form Factor Committee
1125 description: Solomon Goldentek Display Corporation
1127 description: SG Micro Corp
1129 description: SGX Sensortech
1131 description: Sharp Corporation
1133 description: SHIFT GmbH
1135 description: Shimafuji Electric, Inc.
1137 description: Shiratech Solutions
1139 description: Si-En Technology Ltd.
1141 description: Silicon Linux Corporation
1143 description: SiFive, Inc.
1145 description: Sigma Designs, Inc.
1147 description: Seiko Instruments, Inc.
1149 description: Silicon Image
1151 description: Silicon Laboratories
1153 description: Hangzhou Silan Microelectronics Co., Ltd.
1155 description: Silead Inc.
1157 description: Silergy Corp.
1158 "^silex-insight,.*":
1159 description: Silex Insight
1161 description: Siliconfile Technologies lnc.
1163 description: Silicon Mitus, Inc.
1165 description: Siemens AG
1167 description: Cypress Semiconductor Corporation (Simtek Corporation)
1169 description: Sinlinx Electronics Technology Co., LTD
1171 description: SinoVoip Co., Ltd
1173 description: SINO WEALTH Electronic Ltd.
1175 description: Shenzhen Sipeed Technology Co., Ltd.
1177 description: SiRF Technology, Inc.
1179 description: Silicon Integrated Systems Corp.
1181 description: Sitronix Technology Corporation
1183 description: SKOV A/S
1185 description: Skyworks Solutions, Inc.
1187 description: SmartLabs LLC
1189 description: Standard Microsystems Corporation
1191 description: Synopsys, Inc.
1193 description: Shenzhen SoChip Technology Co., Ltd.
1195 description: Socionext Inc.
1197 description: SolidRun
1199 description: Solomon Systech Limited
1201 description: Sony Corporation
1203 description: Spansion Inc.
1205 description: SparkFun Electronics
1207 description: SpinalHDL
1209 description: Spreadtrum Communications Inc.
1211 description: SSI Computer Corp
1213 description: Silicon Storage Technology, Inc.
1215 description: Xiamen Xingchen(SigmaStar) Technology Co., Ltd.
1216 (formerly part of MStar Semiconductor, Inc.)
1218 description: STMicroelectronics
1220 description: StarFive Technology Co. Ltd.
1222 description: Starry Electronic Technology (ShenZhen) Co., LTD
1224 description: Startek
1226 description: ST-Ericsson
1229 description: ST-Ericsson
1231 description: ST-Ericsson
1234 description: StorLink Semiconductors, Inc.
1236 description: Storm Semiconductor, Inc.
1238 description: Storopack
1240 description: Summit microelectronics
1242 description: Shenzhen Sunchip Technology Co., Ltd
1244 description: Sundance DSP Inc.
1246 description: Sunplus Technology Co., Ltd.
1248 description: Sun Microsystems, Inc
1250 description: Super Micro Computer, Inc.
1252 description: Silvaco, Inc.
1254 description: Sierra Wireless
1256 description: Synaptics Inc.
1258 description: Synology, Inc.
1260 description: Synopsys, Inc. (deprecated, use snps)
1263 description: TBS Technologies
1264 "^tbs-biometrics,.*":
1265 description: Touchless Biometric Systems AG
1267 description: Trusted Computing Group
1269 description: Toby Churchill Ltd.
1271 description: Shenzhen City Tang Cheng Technology Co., Ltd.
1273 description: Shangai Top Display Optoelectronics Co., Ltd
1275 description: TechNexion
1277 description: Technologic Systems
1279 description: Teltonika Networks
1281 description: Tempo Semiconductor
1283 description: Shenzhen Techstar Electronics Co., Ltd.
1285 description: Terasic Inc.
1287 description: Tesla, Inc.
1289 description: Three Five Corp
1291 description: T-Head Semiconductor Co., Ltd.
1293 description: THine Electronics, Inc.
1295 description: thingy.jp
1297 description: Thundercomm Technology Co., Ltd.
1299 description: Texas Instruments
1301 description: Tianma Micro-electronics Co., Ltd.
1303 description: Trusted Logic Mobility
1305 description: Tecon Microprocessor Technologies, LLC.
1309 description: Topic Embedded Systems
1311 description: TPO (deprecated, use tpo)
1314 description: Topwise Communication Co., Ltd.
1316 description: Toradex AG
1318 description: Toshiba Corporation
1322 description: TPK U.S.A. LLC
1324 description: TP-LINK Technologies Co., Ltd.
1328 description: TQ-Systems GmbH
1330 description: Traverse Technologies Australia Pty Ltd
1334 description: Tronsmart
1336 description: Truly Semiconductors Limited
1338 description: Visionox
1339 "^team-source-display,.*":
1340 description: Shenzhen Team Source Display Technology Co., Ltd. (TSD)
1342 description: Theobroma Systems Design und Consulting GmbH
1344 description: Tyan Computer Corporation
1348 description: U-Boot bootloader
1350 description: uCRobotics
1352 description: Ubiquiti Networks
1356 description: Ugoos Industrial Co., Ltd.
1358 description: United Western Technologies Corp (UniWest)
1360 description: uPI Semiconductor Corp.
1362 description: United Radiant Technology Corporation
1364 description: Universal Scientific Industrial Co., Ltd.
1366 description: Aigo Digital Technology Co., Ltd.
1368 description: V3 Semiconductor
1370 description: Vaisala
1372 description: Vamrs Ltd.
1374 description: Variscite Ltd.
1376 description: Van der Laan b.v.
1378 description: Vertexcom Technologies, Inc.
1380 description: VIA Technologies, Inc.
1382 description: Vicor Corporation
1384 description: Videostrong Technology Co., Ltd.
1386 description: Virtual I/O Device Specification, developed by the OASIS consortium
1388 description: Used for virtual device without specific vendor.
1390 description: Vishay Intertechnology, Inc
1392 description: Vitesse Semiconductor Corporation
1394 description: Vivante Corporation
1396 description: Vivax brand by M SAN Grupa d.o.o.
1398 description: VoCore Studio
1400 description: Voipac Technologies s.r.o.
1402 description: Vision Optical Technology Co., Ltd.
1404 description: VXT Ltd
1406 description: Wandbord (Technexion)
1408 description: Waveshare Electronics
1410 description: Western Digital Corp.
1412 description: Würth Elektronik GmbH.
1414 description: Welltech Computer Co., Limited.
1416 description: WeTek Electronics, limited.
1420 description: Shenzhen whwave Electronics, Inc.
1422 description: Wi2Wi, Inc.
1424 description: Wiligear, Ltd.
1426 description: Will Semiconductor Ltd.
1428 description: Winbond Electronics corp.
1430 description: Wingtech Technology Co., Ltd.
1432 description: WinLink Co., Ltd
1434 description: Winstar Display Corp.
1436 description: Wireless Tag (qiming yunduan)
1438 description: Shenzhen Merrii Technology Co., Ltd. (WITS)
1440 description: Wolfson Microelectronics
1442 description: Wondermedia Technologies, Inc.
1446 description: Wanchanglong Electronics Technology(SHENZHEN)Co.,Ltd.
1448 description: X-Powers
1450 description: Xen Hypervisor
1452 description: Extreme Engineering Solutions (X-ES)
1454 description: Xiaomi Technology Co., Ltd.
1456 description: Xillybus Ltd.
1458 description: Shenzhen Xingbangda Display Technology Co., Ltd
1460 description: Shenzhen Xinpeng Technology Co., Ltd
1462 description: Xiphera Ltd.
1468 description: Shenzhen Xunlong Software CO.,Limited
1474 description: Yamaha Corporation
1475 "^yes-optoelectronics,.*":
1476 description: Yes Optoelectronics Co.,Ltd.
1478 description: YIC System Co., Ltd.
1480 description: Shenzhen Yangliming Electronic Technology Co., Ltd.
1482 description: YSH & ATIL
1483 "^yones-toptech,.*":
1484 description: Yones Toptech Co., Ltd.
1486 description: Shenzhen Yashi Changhua Intelligent Technology Co., Ltd.
1488 description: Y Soft Corporation a.s.
1492 description: Zarlink Semiconductor
1494 description: ZEITEC Semiconductor Co., LTD.
1496 description: Shenzhen Zidoo Technology Co., Ltd.
1498 description: Zodiac Inflight Innovations
1500 description: Zinitix Co., Ltd
1502 description: Shenzhen Zkmagic Technology Co., Ltd.
1504 description: ZTE Corp.
1506 description: ZyXEL Communications Corp.
1508 # Normal property name match without a comma
1509 # These should catch all node/property names without a prefix
1510 "^[a-zA-Z0-9#_][a-zA-Z0-9+\\-._@]{0,63}$": true
1511 "^[a-zA-Z0-9+\\-._]*@[0-9a-zA-Z,]*$": true
1514 additionalProperties: false